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US 8,012,808 B2Granted
Integrated micro-channels for 3D through silicon architectures
AssigneeIntel Corporation
InventorsWei Shi, Daoqiang Lu, Yiqun Bai, Qing A. Zhou, Jianqqi He
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Abstract
Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.
Claims12
A method comprising:
- forming a deep opening and a shallow opening in a substrate;
- forming an opening in a second substrate;
- subsequentially bonding said substrate and said second substrate wherein the deep opening and the opening are substantially aligned, which forms a micro-channel;
- thinning said substrate;
- and
- forming a conductive through via in said deep opening and said opening.
3 more elements
Dependencies are inferred from the claim text.