Method of fabricating a stacked type chip package structure and a stacked type package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChau-Chin Yang
Life of this patent
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Abstract
A method of fabricating a stacked type chip package structure is provided. The method includes following steps. First, a substrate, a first chip, and a second chip are provided. A number of bumps are disposed on a surface of the second chip. The second chip is then fixed on a surface of the first chip. Next, the second chip and the first chip on the substrate are turned upside down, and then the second chip is electrically connected to the substrate through the bumps by using a flip chip bonding technique. After that, the first chip is electrically connected to the substrate. Finally, a molding compound is formed on the substrate for encapsulating the first chip, the second chip, and the bumps.
Claims20
A method of fabricating a stacked type package structure, comprising:
- providing a first substrate, a chip package, and a second chip, wherein the chip package comprises a second substrate, a first chip disposed on and electrically connected to the second substrate, and a first molding compound disposed on the second substrate for encapsulating the first chip, the first substrate and the second substrate respectively having an upper surface and a bottom surface opposite to the upper surface, the second chip having a first surface and a second surface opposite to the first surface, and the second chip comprising a plurality of bumps disposed on the second surface thereof;
- fixing the first surface of the second chip to the first molding compound;
- turning the chip package and the second chip upside down on the upper surface of the first substrate and electrically connecting the second chip to the first substrate through the bumps by using a flip chip bonding technique, wherein the second chip is bonded to the chip package before being bonded to the first substrate;
- electrically connecting the first substrate to the second substrate;
- and
- forming a second molding compound on the first substrate for encapsulating the chip package, the second chip, and the bumps.
A method of fabricating a stacked type package structure, comprising:
- bonding a first chip onto a first surface of a first substrate;
- encapsulating the first chip by forming a first molding compound on the first surface of the first substrate to form a package unit;
- attaching a second chip onto the first molding compound;
- after attaching the second chip onto the first molding compound, integrating the package unit with a second substrate by flip-chip bonding the second chip onto the second substrate;
- electrically connecting a contact on a second surface of the first substrate to the second substrate, the second surface being opposite to the first surface;
- and
- encapsulating the package unit and the second chip by forming a second molding compound on the second substrate.
Dependencies are inferred from the claim text.