Method of assembling semiconductor device with heat spreader

A method of assembling a semiconductor device including a heat spreader, the method comprising:

• attaching the heat spreader to a heat resistant film;
• placing the film with the attached heat spreader into a first mold section;
• dispensing a mold compound onto the film such that the mold compound at least partially covers the film and the heat spreader;
• providing a substrate having a semiconductor die attached and electrically coupled thereto;
• attaching the substrate with the attached die to a second mold section;
• mating the first and second mold sections such that the die is covered by the heat spreader;
• heating the mold compound, wherein after melting, at least the die and sides of the heat spreader are covered by the mold compound;
• separating the first and second mold sections, wherein the film adheres to the substrate;
• and
• removing the film to expose a top surface of the heat spreader, whereby the semiconductor device is formed.

A method of assembling a semiconductor device including a heat spreader having a generally U-shaped cross-section, the method comprising:

• attaching the heat spreader to a heat resistant film with a double-sided tape;
• dispensing a mold compound onto the film such that the mold compound at least partially covers the film and the heat spreader;
• placing the film with the attached heat spreader into a first mold section;
• providing a substrate having a semiconductor die attached and electrically coupled thereto;
• attaching the substrate with the attached die to a second mold section;
• mating the first and second mold sections such that the die is covered by the heat spreader;
• melting the mold compound at least until the mold compound covers the die and sides of the heat spreader;
• curing the mold compound;
• separating the first and second mold sections, wherein the film adheres to the substrate;
• and
• removing the film to expose a top surface of the heat spreader, whereby the semiconductor device is formed.