Method and device for fabricating an assembly of at least two microelectronic chips
AssigneeCommissariat a l'Energie Atomique
InventorsJean Brun, Benoît Lepine, Bruno Mourey, Dominique Vicard
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Abstract
The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.
Claims11
A method for fabricating an assembly of at least two microelectronic chips, wherein said chips are made on a wafer and each chip comprises two parallel main faces joined by side faces, at least one of the side faces comprising at least one groove, the method comprises the following successive steps:
- sticking the wafer onto a flexible film,
- cutting the chips,
- deforming the flexible film in the proximity of the at least one groove of at least one chip to make the groove accessible,
- embedding a thread element in said groove of said chip, arranged in an insertion area,
- and removing the chip from the flexible film in a removal area.
Dependencies are inferred from the claim text.