Electronic components and methods for producing same

A method for producing, on a substrate, an electronic component with closely adjacent electrodes, the method comprising:

• depositing a first metal layer onto the substrate;
• structuring a first photo lacquer on a surface of the first metal layer, wherein a portion of the surface of the first metal layer does not have the first photo lacquer thereon;
• etching the portion of the surface of the first metal layer not having the first photo lacquer;
• undercut etching the first metal layer so that an overhang is defined by the first photo lacquer;
• exposing, to a metal vapor, a surface of the first photo lacquer and an exposed portion of the substrate where the first metal layer was etched away so that a second metal layer is formed on the surface of the first photo lacquer and the exposed portion of the substrate where the first metal layer was etched away except in a space between the overhang and the substrate;
• removing the second metal layer from the surface of the first photo lacquer and removing the first photo lacquer;
• etching a hole into the substrate at a position other than a position of the first metal layer and the second metal layer;
• depositing a third metal layer onto the substrate, the first metal layer, and the second metal layer;
• applying an insulator onto the third metal layer;
• applying an organic semiconductor onto the third metal layer and the insulator;
• and
• applying a sealing layer onto the organic semiconductor.