Packaging process of light emitting diode
AssigneeLextar Electronics Corporation
InventorsWen-Sung Chang, Cheng-Ta Kuo
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Abstract
A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carrier by a dispensing process to encapsulate the LED chip, wherein the viscosity of the encapsulant before contacting the carrier is lower than that of the encapsulant after contacting the carrier. Thereafter, the encapsulant is cured.
Claims20
A packaging process of a light emitting diode, comprising:
- bonding a light emitting diode (LED) chip with a carrier to electrically connect the LED chip and the carrier;
- heating the carrier to raise a temperature thereof;
- dispensing an encapsulant onto the heated carrier to encapsulate the LED chip, wherein the temperature of the heated carrier is such to cause the viscosity of the encapsulant to increase rapidly at a rate as rapid as at least 3500 mPas in 70 minutes, such that the encapsulant rapidly forms a predetermined height and shape prior to curing of the encapsulant without using a dam structure;
- and
- curing the encapsulant after forming the predetermined height and shape.
A process of packaging a light emitting diode (LED), comprising:
- supporting an LED chip on a carrier;
- heating the carrier to a desired temperature;
- dispensing an encapsulant onto the heated carrier to cover the LED chip, wherein the temperature of the heated carrier is such to cause the viscosity of the encapsulant to increase rapidly at a rate as rapid as at least 3500 mPas in 70 minutes, such that the encapsulant rapidly forms a predetermined height and shape prior to curing of the encapsulant without using a dam structure;
- and
- curing the encapsulant after forming the predetermined height and shape.
Dependencies are inferred from the claim text.