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US 8,012,776 B2Granted
Methods of manufacturing imaging device packages
AssigneeMicron Technology, Inc.
InventorJames Derderian
Life of this patent
Estimating the term…
Abstract
Methods of manufacturing an imaging device package are provided. In accordance with an embodiment a sensor die may be coupled to bond pads on a transparent substrate. Electrically conductive paths comprising bond wires are formed through the bond pads from the sensor die to an outer surface of the imaging device package.
Claims20
A method of manufacturing an imaging device package comprising:
- providing a transparent substrate having bond pads;
- coupling a sensor die to the bond pads, wherein an active side of the sensor die faces the transparent substrate;
- and
- forming electrically conductive paths between the bond pads and an external package, wherein the electrically conductive paths comprise bond wires formed through an encapsulant such that a second end of each respective bond wire is exposed on an outer surface of the encapsulant.
1 more element
A method of manufacturing an imaging device package comprising:
- attaching a sensor die to a substrate, such that the sensor die is electrically coupled to a plurality of bond pads on the substrate;
- attaching a first end of a respective bond wire to each of the plurality of bond pads;
- and
- forming an encapsulant around the sensor die on the substrate such that a second end of each respective bond wire is exposed on an outer surface of the encapsulant.
1 more element
A method of manufacturing an imaging device package comprising:
- electrically coupling a sensor die to a transparent substrate via a plurality of conductive elements;
- forming a respective electrically conductive path through each of the plurality of conductive elements to an outer surface of the imaging device package,
- wherein forming the respective electrically conductive path comprises forming the respective electrically conductive path through each of the plurality of conductive elements and through each of a plurality of bond wires, and wherein the forming the respective electrically conductive path through each of the plurality of bond wires comprises coupling a first end of each of the plurality of bond wires to a respective bond pad on the transparent substrate and positioning a second end of each of the plurality of bond wires to be exposed at the outer surface of the imaging device package.
Dependencies are inferred from the claim text.