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US 8,012,667 B2Granted
Soft mold and method of fabricating the same
AssigneeLG Display Co., Ltd.
InventorsYeon Heui Nam, Jin-Wuk Kim
Life of this patent
Estimating the term…
Abstract
A soft mold may be manufactured that is used for forming a pattern. Semiconductor devices and flat panel display devices include a plurality of fine patterns on a substrate. The soft mold may be photo-curable and formed of a material with a hydrophobic property similar to heat-curable molds. The photo-curable mold may be created on a master plate with a resin layer that is removed with a back plate and adhesive layer after embossed or depressed portions are formed on the mold that correspond with embossed or depressed portions of the master plate.
Claims15
A soft mold, comprising:
- a UV light cured product of a resin layer, the resin layer including a photo-curable material;
- and a photo-initiator combined with the photo-curable material
- wherein the soft mold is treated in a post-treatment process using UV light such that each surface of the soft mold satisfies an equation
- (
- 0.3
- ×
- γ
- M
- d
- γ
- L
- )
- 1
- /
- 2
- +
- (
- 0.7
- ×
- γ
- M
- p
- γ
- L
- )
- 1
- /
- 2
- ≤
- 0.5
- ,
- wherein γdM is a dispersion term of a surface energy of the soft mold, γpM is a polar term of a surface energy of the soft mold, and γL is a surface energy of deionized water.
- wherein the photo-curable material is one or more selected from diethylene glycol dimethacrylate (DGDMA), ethylene glycol dimethacrylate (EGDMA), ethylene glycol phenyletheracrylate (EGPEA), 2-ethoxy-(2-ethoxy)ethyl acrylate (EOEOEA), 1,6-hexanediol (EO) diacrylate (HD(EO)DA), polyurethane acrylate, glycidyl acrylate, or butyl methacrylate.
30 more elements
A method of fabricating a soft mold, comprising:
- providing a master plate having depressed or embossed portions;
- disposing a resin layer on the master plate;
- curing the resin layer by irradiating UV light to the resin layer;
- detaching the cured resin layer from the master plate to thereby form the soft mold;
- and
- irradiating UV light to the soft mold after detaching the cured resin layer from the master plate such that each surface of the soft mold satisfies an equation
- (
- 0.3
- ×
- γ
- M
- d
- γ
- L
- )
- 1
- /
- 2
- +
- (
- 0.7
- ×
- γ
- M
- p
- γ
- L
- )
- 1
- /
- 2
- ≤
- 0.5
- ,
- wherein γdM is a dispersion term of a surface energy of the soft mold, γpM is a polar term of a surface energy of the soft mold, and γL is a surface energy of deionized water,
- wherein the resin layer includes a photo-curable material and a photo-initiator
- wherein the photo-curable material is one or more selected from diethylene glycol dimethacrylate (DGDMA), ethylene glycol dimethacrylate (EGDMA), ethylene glycol phenyletheracrylate (EGPEA), 2-ethoxy-(2-ethoxy)ethyl acrylate (EOEOEA), 1,6-hexanediol (EO) diacrylate (HD(EO)DA), polyurethane acrylate, glycidyl acrylate, and butyl methacrylate.
34 more elements
A soft mold for creating a pattern comprising:
- a UV light cured product of a resin layer, the resin layer including_a photo-curable material, wherein the photo-curable material comprises one or more of diethylene glycol dimethacrylate (DGDMA), ethylene glycol dimethacrylate (EGDMA), ethylene glycol phenyletheracrylate (EGPEA), 2-ethoxy-(2-ethoxy)ethyl acrylate (EOEOEA), 1,6-hexanediol (EO) diacrylate (HD(EO)DA), polyurethane acrylate, glycidyl acrylate, or butyl methacrylate;
- and a photo-initiator combined with the photo-curable material,
- wherein the soft mold is treated in a post-treatment process using UV light such that each surface of the soft mold has a hydrophobic property.
A method for producing a photo-curable soft mold comprising:
- disposing a resin layer including a photo-curable material on a master plate, wherein the photo-curable material comprises one or more of diethylene glycol dimethacrylate (DGDMA), ethylene glycol dimethacrylate (EGDMA), ethylene glycol phenyletheracrylate (EGPEA), 2-ethoxy-(2-ethoxy)ethyl acrylate (EOEOEA), 1,6-hexanediol (EO) diacrylate (HD(EO)DA), polyurethane acrylate, glycidyl acrylate, or butyl methacrylate;
- contacting a back plane with the resin layer;
- curing the resin layer using a photo-initiator by irradiating ultraviolet light on the resin layer;
- removing the resin layer from the master plate to form the photo-curable soft mold;
- and
- irradiating UV light to the photo-curable soft mold after removing the resin layer from the master plate such that each surface of the photo-curable soft mold has a hydrophobic property.
3 more elements
A method of forming a pattern using a soft mold comprising:
- forming a thin film on a substrate;
- applying a resist to the thin film on the substrate;
- disposing a soft mold on the resist, wherein the soft mold includes at least one depressed pattern, further wherein the soft mold comprises a UV light cured product of a resin layer, the resin layer including a photo-curable material and a photo-initiator, wherein the soft mold is treated in a post-treatment process using UV light such that the soft mold has a hydrophobic property, wherein the photo-curable material is one or more selected from diethylene glycol dimethacrylate (DGDMA), ethylene glycol dimethacrylate (EGDMA), ethylene glycol phenyletheracrylate (EGPEA), 2-ethoxy-(2-ethoxy)ethyl acrylate (EOEOEA), 1,6-hexanediol (EO) diacrylate (HD(EO)DA), polyurethane acrylate, glycidyl acrylate, or butyl methacrylate;
- and
- removing the soft mold from the substrate to form at least one desired pattern on the substrate.
2 more elements
Dependencies are inferred from the claim text.