Functional film containing structure and method of manufacturing functional film
AssigneeFUJIFILM Corporation
InventorYukio Sakashita
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Abstract
A method of manufacturing a functional film by which the functional film formed on a film formation substrate can be easily peeled from the film formation substrate. The method includes the steps of: (a) forming a separation layer by using an inorganic material on a substrate containing a material having heat tolerance to a predetermined temperature; (b) forming a layer to be peeled containing a functional film, which is formed by using a functional material, on the separation layer; and (c) performing heat treatment on a structure containing the substrate, the separation layer and the layer to be peeled at the predetermined temperature so as to peel the layer to be peeled from the substrate or reducing bonding strength between the layer to be peeled and the substrate.
Claims20
A functional film containing structure comprising:
- a substrate;
- a separation layer provided on said substrate;
- and
- a layer to be peeled provided on said separation layer and containing one of a functional film consisting of at least one metal and a functional film consisting of an oxide of at least one metal material;
- wherein said separation layer contains at least one of carbonate, sulfate, nitrate, metal nitride, metal carbide, and metal sulfide such that said layer to be peeled is capable of being peeled from said substrate or bonding strength between said layer to be peeled and said substrate becomes lower by heating said separation layer.
A method of manufacturing a functional film, said method comprising the steps of:
- (a) forming a separation layer on a substrate containing a material having heat tolerance to a predetermined temperature, said separation layer containing at least one of carbonate, sulfate, nitrate, metal nitride, metal carbide, and metal sulfide;
- (b) providing a layer to be peeled containing one of a functional film consisting of at least one metal material and a functional film consisting of an oxide of at least one metal material, on said separation layer;
- and
- (c) performing heat treatment on a structure containing said substrate, said separation layer and said layer to be peeled at the predetermined temperature so as to peel said layer to be peeled from said substrate or reduce bonding strength between said layer to be peeled and said substrate.
Dependencies are inferred from the claim text.