Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
AssigneeHitachi Chemical Company, Ltd.
InventorsKeisuke Ookubo, Teiichi Inada
Life of this patent
Estimating the term…
Abstract
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250° C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.
Claims5
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and capable of being used in both a dicing step and a semiconductor element adhesion step,
- wherein the yield elongation of the supporting substrate at room temperature is 20% or more,
- wherein the adhesive bonding layer comprises (a) a polymer component having a weight average molecular weight of 100,000 or more including functional groups, (b) an epoxy resin, (c) an epoxy resin curing agent, (d) a photoreactive monomer, wherein the Tg of cured material of the photoreactive monomer, obtained by ultraviolet light irradiation, is 250° C. or more, and (e) a photoinitiator, and
- wherein the photoreactive monomer is dipentaerythritol hexacrylate or ethoxylated isocyanuric acid triacrylate.
Dependencies are inferred from the claim text.