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US 8,012,566 B2Granted
Microneedles formed by electroplating and selectively releasing temperature sensitive layers
AssigneeHewlett-Packard Development Company, L.P.
InventorsRamesh Govinda Raju, Patricia A. Beck
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Abstract
Methods and structures including a release mechanism for use with the formation and then separation of a multi-layered structure are provided. The methods and structures provide for a master substrate on which is formed a temperature-sensitive release layer. A releasable structure is then formed on top of the temperature-sensitive release layer. The releasable structure can be freed from the master substrate by exposing the temperature-sensitive release layer to a temperature sufficient to soften or melt of the release layer.
Claims18
A fabricated composite structure, comprising:
- a master substrate that serves as a template for forming a microneedle, the master substrate comprising:
- a first layer having a surface and a topography;
- and
- an electrically conductive seed layer formed over the surface of the first layer and formed so as to mimic the topography of the first layer;
- a micromold formed over the electrically conductive seed layer, the micromold having an inner facing surface with respect to the surface of the first layer of the master substrate and an opposed outer facing surface with respect to the surface of the first layer of the master substrate, a desired shape along the outer surface that defines a shape of the formed microneedle, and a through-hole defined between the outer facing surface and the inner facing surface;
- a temperature sensitive layer conforming to and in contact with at least a portion of the inner facing or the outer facing surfaces of the micromold;
- and
- the microneedle formed of a releasable layer established over the outer facing surface such that the microneedle mimics the desired shape of the outer facing surface, the microneedle having an opening therethrough having been defined by the through-hole of the micromold;
- wherein, when the temperature sensitive layer is heated to a suitable temperature, at least the microneedle is released from the master substrate.
6 more elements
A fabricated composite structure, comprising:
- a master substrate that serves as a template for forming a releasable part, the master substrate comprising:
- a first layer having a surface and a topography;
- and
- an electrically conductive seed layer formed over the surface of the first layer and formed so as to mimic the topography of the first layer;
- a mold formed over the electrically conductive seed layer, the mold having an inner facing surface with respect to the surface of the first layer of the master substrate and an opposed outer facing surface with respect to the surface of the first layer of the master substrate, a desired shape along the outer surface, and a through-hole defined between the outer facing surface and the inner facing surface;
- a temperature sensitive layer conforming to and in contact with at least a portion of the inner facing or the outer facing surfaces of the mold;
- and
- the releasable part formed of a releasable layer established over the outer facing surface such that the part mimics the desired shape of the outer facing surface;
- wherein, when the temperature sensitive layer is heated to a suitable temperature, at least the releasable part is released from the master substrate;
- wherein the temperature sensitive layer is positioned between a portion of the electrically conductive seed layer and the inner facing surface of the mold, and wherein the releasable layer is established directly on and in contact with the outer facing surface having the desired shape.
7 more elements
A fabricated composite structure, comprising:
- a master substrate that serves as a template for forming a releasable part, the master substrate comprising:
- a first layer having a surface and a topography;
- and
- an electrically conductive seed layer formed over the surface of the first layer and formed so as to mimic the topography of the first layer;
- a mold formed over the electrically conductive seed layer, the mold having an inner facing surface with respect to the surface of the first layer of the master substrate and an opposed outer facing surface with respect to the surface of the first layer of the master substrate, a desired shape along the outer surface, and a through-hole defined between the outer facing surface and the inner facing surface;
- a temperature sensitive layer conforming to and in contact with at least a portion of the inner facing or the outer facing surfaces of the mold;
- and
- the releasable part formed of a releasable layer established over the outer facing surface such that the part mimics the desired shape of the outer facing surface;
- wherein, when the temperature sensitive layer is heated to a suitable temperature, at least the releasable part is released from the master substrate, wherein the temperature sensitive layer is positioned on and conforms to the entire outer facing surface having the desired shape, and wherein the releasable layer is established on the temperature sensitive layer.
6 more elements
Dependencies are inferred from the claim text.