White heat-curable silicone resin composition and optoelectronic part case
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYusuke Taguchi, Junichi Sawada
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Abstract
A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.
Claims8
A white heat-curable silicone resin composition for forming optoelectronic part cases, comprising
- (A) a heat-curable organopolysiloxane,
- (B) a white pigment,
- (C) an inorganic filler excluding the white pigment,
- (D) a condensation catalyst, and
- (E) a parting agent comprising calcium stearate having a melting point of 120 to 140° C. in an amount of 0.2 to 5.0% by weight based on the total weight of the composition,
- said composition having a reflectance of at least 80% in the wavelength region of 350 to 400 nm.
An optoelectronic part case comprising a silicone resin composition in the cured state, said composition comprising
- (A) a heat-curable organopolysiloxane,
- (B) a white pigment,
- (C) an inorganic filler excluding the white pigment,
- (D) a condensation catalyst, and
- (E) a parting agent comprising calcium stearate having a melting point of 120 to 140° C. in an amount of 0.2 to 5.0% by weight based on the total weight of the composition,
- said composition having a reflectance of at least 80% in the wavelength region of 350 to 400 nm,
- in which cured composition a transparent resin-encapsulated optoelectronic part is enclosed.
Dependencies are inferred from the claim text.