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AssigneePanasonic Corporation
InventorsHidenori Miyakawa, Shigeaki Sakatani, Kumiko Sugiyama, Takayuki Higuchi, Atsushi Yamaguchi
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A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
A method of preparing a circuit board having a circuit-wiring pattern on the surface of said board comprising:
A method of preparing a multilayered circuit board, wherein a plurality of wiring layers are superposed on each other and at least two wiring layers are electrically connected to each other through one or more holes penetrating the circuit board, comprising:
A method of preparing an electric-component mounted body having one or more circuit boards to which one or more electric components are mounted, comprising:
Dependencies are inferred from the claim text.