Metal plating compositions and methods

A composition comprising one or more sources of metal ions chosen from copper, tin, nickel, gold, silver, palladium, platinum, indium or alloys thereof, and one more compounds

• having a formula:
• H-A′p-Q-[C(O)—CH2O—((R1CH)t—O)z—CH2—C(O)—NH-A]u-H (I)
• where A′ is —(NH—(CH2)x′)y′—;
• —NH(CH2)x′—(O—(CHR1)r′)w′—O—(CH2)x′—;
• or —NH—((R1CH)r′—O)w′—C2H4—,
• A is —((CH2)x—NH)y—;
• —(CH2)x—(O—(CHR1)r)w—O—(CH2)x—NH—;
• or —((R1CH)r—O)w—C2H4—NH—,
• R1 is —H or —CH3,
• Q is —NH— when p=1 or —O— when p=0,
• p is 0 or 1, wherein H— and Q form a chemical bond when p=0,
• r′ is an integer from 2 to 4,
• w′ is an integer from 1 to 50,
• x′ is an integer from 2 to 6,
• y′ is an integer from 0 to 5,
• wherein H— and Q form a chemical bond when y′ is 0,
• r is an integer from 2 to 4,
• w is an integer from 1 to 50,
• x is an integer from 2 to 6,
• y is an integer from 0 to 5, wherein H— is bonded to the nitrogen of terminal —C(O)—NH— when y is 0,
• t is an integer from 2 to 4,
• u is an integer from 1 to 20,
• w is an integer from 1 to 50, and
• z is an integer from 1 to 50.