Back to results
US 8,012,292 B2Granted
Multilayer adhesive for thermal reversible joining of substrates
AssigneeGM Global Technology Operations LLC
InventorsTao Xie, Xingcheng Xiao, Ruomiao Wang, Hamid G. Kia, Jessica A. Schroeder, Todd E. Durocher
Life of this patent
Estimating the term…
Abstract
One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.
Claims8
A method comprising:
- placing a multiplayer adhesive system between a first substrate and a second substrate, the multiplayer adhesive system comprising a first dry adhesive layer having a first curved profile, a second dry adhesive layer having a second curved profile, and shape memory polymer layer therebetween;
- heating the multiplayer adhesive system;
- pressing the substrates together with the heated multiplayer adhesive system therebetween and cooling the multiplayer adhesive system under load to attach the first substrate to the second substrate;
- and
- thereafter heating the multiplayer adhesive system so that the multiplayer adhesive system changes shape and peels away from the substrates from the outer edges of the multilayer dry adhesive system.
2 more elements
A method comprising:
- placing a multilayer adhesive system between a first substrate and a second substrate, the multilayer adhesive system comprising a first dry adhesive layer, a second dry adhesive layer, and shape memory polymer layer therebetween, wherein the shape memory polymer layer comprises a first portion adjacent to the first dry adhesive layer and a second portion adjacent to the second dry adhesive layer and a cavity therebetween, wherein an outer surface of each of the first dry adhesive layer and the second dry adhesive layer has a convex shape, and wherein the thickness of the cavity is the greatest in a center portion of the multilayer adhesive system and tapers to outer edges thereof;
- heating the multilayer adhesive system;
- pressing the substrates together with the heated multilayer adhesive system therebetween and cooling the multilayer adhesive system under load to attach the first substrate to the second substrate;
- and
- thereafter heating the multilayer adhesive system so that the multilayer adhesive system changes shape and peels away from the substrates from the outer edges of the multilayer dry adhesive system.
2 more elements
A method comprising:
- placing a multilayer adhesive system between a first substrate and a second substrate, the multilayer adhesive system comprising a first dry adhesive layer, a second dry adhesive layer, and shape memory polymer layer therebetween, wherein the shape memory polymer layer has a geometry thickest in a center portion of the shape memory polymer layer and tapering to the outer edges thereof;
- heating the multilayer adhesive system;
- pressing the substrates together with the heated multilayer adhesive system therebetween and cooling the multilayer adhesive system under load to attach the first substrate to the second substrate;
- and
- thereafter heating the multilayer adhesive system so that the multilayer adhesive system changes shape and peels away from the substrates from the outer edges of the multilayer dry adhesive system.
2 more elements
Dependencies are inferred from the claim text.