System and method for scrubbing CMP slurry systems
AssigneeHoneywell International Inc.
InventorsJohn W. Janzen, Daniel K. Casey
Life of this patent
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Abstract
A system and apparatus for cleaning particle deposits from slurry distribution system components by injecting gas bubbles into the slurry solution having a geometry and interval such that an optimal cleaning power and cleaning rate is obtained. The method provides efficient cleaning of the buildup of abrasive particles deposited from the slurry solution without requiring the operator to disassemble or flush the slurry distribution system. The system cleaning potential is optimal when the diameter of the bubbles and the fluid slug length is approximately equal to the pipe diameter.
Claims9
A method for cleaning a fluid distribution system containing a fluid, comprising:
- injecting gas bubbles into the fluid of the fluid distribution system, the gas bubbles having a diameter substantially equal to a fluid slug length between the gas bubbles;
- and
- passing the fluid containing the gas bubbles over a surface of the fluid distribution system such that a physical shock associated with the bubbles and fluid passing over particle deposits on the surface of the fluid distribution system dislodges the particle deposits,
- wherein the gas bubble diameter and the fluid slug length are varied periodically to obtain a bubble diameter and fluid slug length substantially equal to one of a plurality of pipe diameters in the fluid distribution system.
Dependencies are inferred from the claim text.