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US 8,011,999 B2Granted
Polishing pad, method for manufacturing the polishing pad
AssigneeFujitsu Semiconductor Limited
InventorsHiromasa Nagase, Akio Yokofuke, Hiroshi Misawa
Life of this patent
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Abstract
A polishing pad with first plural concave portions regularly allocated with prescribed spacing or/and a groove formed on the surface of the polishing pad; and a second concave portion randomly allocated without corresponding to the first plural concave portions or/and the groove formed on the surface of the polishing pad.
Claims6
A method for manufacturing a polishing pad, the method comprising:
- forming a foamed polyurethane sheet;
- forming first concave portions or/and grooves regularly allocated on the foamed polyurethane sheet;
- after forming the first concave portions or/and the grooves, detecting defective parts of the foamed polyurethane sheet by irradiating light through the foamed polyurethane sheet;
- and
- after detecting the defective parts, removing the detected defective parts and thereby forming second concave portions on the foamed polyurethane sheet.
2 more elements
Dependencies are inferred from the claim text.