Compression molding of an electronic device

Molding system for molding an electronic device comprising:

• first and second mold halves operable to close against each other to clamp the electronic device therebetween;
• the first mold half comprising a cavity strip including a plurality of cavities corresponding to molding locations on the electronic device, the first mold half further comprising a base plate and a middle plate located between the cavity strip and the base plate, the middle plate being movably connected to the base plate, and the first mold half comprising springs connecting the middle plate to the cavity strip and separating the middle plate from the cavity strip, the entire first mold half being drivable with respect to the second mold half to close the cavity strip against the second mold half to clamp the electronic device;
• a plurality of plungers fixedly attached to the middle plate, each of the plungers being drivable relative to both the first and second mold halves against a side of a respective cavity for applying a compacting force to an encapsulation material located in the respective cavity during molding;
• a motor operatively connected to the plungers, the motor being operable to drive the plungers relative to the cavities and relative to both the first and second mold halves after the first and second mold halves have clamped the electronic device,
• a second motor connected to the second mold half, the second motor being operable to drive a portion of the second mold half against the cavity strip to provide a further compacting force on the encapsulating material after the first and the second mold halves have clamped the electronic device;
• and
• wherein each plunger comprises a molding face for applying the compacting force against the encapsulation material and ensuring that a top surface of a molded package is substantially flat, the molding face consisting of a single recessed cavity having a concave peripheral portion receding to a flattened central portion.