Apparatus and method for thermal connection of optical waveguides

An apparatus for thermally connecting respective ends of at least two optical waveguides, comprising:

• in each case a positioning device which is associated with one of the optical waveguides and by means of which their ends are moved relative to one another to a position which allows a connection produced by the application of heat, the positioning device being roughly adjustable with respect to another positioning device, transversely with respect to a longitudinal direction of the optical waveguides, with a positioning accuracy which is greater than one (1) micrometer, for aligning the ends of the optical waveguides to less than six (6) micrometers of a residual offset;
• an observation device, by means of which a possible offset of the ends of the optical waveguides to be connected is determined;
• a memory, by means of which a predetermined relationship is provided between the possible offset, the predetermined relationship being a combination of lateral and axial offset stored within the memory, the predetermined relationship defining a value;
• and
• a parameter which controls the application of heat by a thermal device by means of which the ends of the optical waveguides are connected as a function of the value which is output from the memory, wherein the parameter is selected from the group consisting of a supply current of the thermal device, an amount of heat produced by the thermal device, an operating time period of the thermal device, and combinations thereof,
• wherein the application of heat from the thermal device, as controlled by the parameter, more closely aligns the optical waveguides as the optical waveguides are connected and compensates for the residual transverse offset.