Droplet discharging head and method of manufacturing the same, and droplet discharging device and method of manufacturing the same
AssigneeSeiko Epson Corporation
InventorsHiroshi Komatsu, Tomoki Sakashita
Life of this patent
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Abstract
A droplet discharging head comprises: a cavity substrate including a discharge chamber having a bottom wall serving as a vibration plate; and an electrode substrate including an individual electrode that faces the vibration plate with a gap and drives the vibration plate, and a driver integrated circuit (IC) that couples with the individual electrode and applies a voltage to the individual electrode. The cavity substrate includes a first opening that penetrates the cavity substrate and serves to house the driver IC, and an insulation film formed on a wall face of the first opening.
Claims10
A droplet discharging head, comprising:
- a cavity substrate including a discharge chamber having a bottom wall serving as a vibration plate;
- and
- an electrode substrate including:
- an individual electrode that faces the vibration plate with a gap and drives the vibration plate;
- and
- a driver integrated circuit (IC) that couples with the individual electrode and applies a voltage to the individual electrode,
- wherein the cavity substrate includes:
- a first opening that penetrates the cavity substrate so as to expose a surface of the electrode substrate and which serves to house the driver IC;
- and
- an insulation film formed at least on a rim of the first opening and without extending into the first opening.
A method for manufacturing a droplet discharging head, comprising:
- forming a first recess and a second recess on a surface of a silicon substrate;
- forming an insulation film on the surface;
- anodic bonding the silicon substrate to an electrode substrate;
- and
- forming a liquid flow path to the silicon substrate,
- wherein the silicon substrate includes a discharge chamber having a bottom wall serving as a vibration plate and the liquid flow path communicating with the discharge chamber, and the electrode substrate includes an individual electrode that faces the vibration plate with a gap and drives the vibration plate, and the first recess that houses a driver integrated circuit (IC) that is mounted on the electrode substrate and couples to the individual electrode and supplies a voltage to the individual electrode, and the second recess corresponds to a flexible printed circuit (FPC) mount area that is formed on the electrode substrate and on which a flexible printed board is mounted to supply a signal for driving the individual electrode,
- wherein the insulation film is formed at least on a rim of the first recess and not extending into an opening defined by the first recess.
Dependencies are inferred from the claim text.