Molded ink manifold with polymer coating
AssigneeSilverbrook Research Pty Ltd
InventorsSeung Jin Lee, Susan Williams, Jan Waszczuk, Kia Silverbrook
Life of this patent
Estimating the term…
Abstract
A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.
Claims20
A printhead assembly comprising:
- a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface;
- one or more printhead integrated circuits, each printhead integrated circuit having one or more ink inlets defined in a printhead bonding surface;
- and
- an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet,
- wherein at least said manifold bonding surface comprises a polymer coating, said polymer coating plugging fissures in said molded ink manifold.
A molded ink manifold for an inkjet printhead, said ink manifold having a manifold bonding surface for attachment of one or more printhead integrated circuits, each of said printhead integrated circuits receiving ink from one or more ink outlets defined in said bonding surface, wherein at least said manifold bonding surface comprises a polymer coating, said polymer coating plugging fissures in said molded ink manifold.
Dependencies are inferred from the claim text.