Compliant mold fill head with integrated cavity venting and solder cooling

A system comprising:

• a mold plate having a plurality of cavities;
• and
• a mold fill head for filling said cavities in said mold plate, said mold fill head in turn comprising:
• a solder delivery head;
• and
• an interlace portion, said interface portion in turn comprising:
• a compliant portion secured to said solder delivery head, wherein said compliant portion is configured to have a curved shape in an absence of forces from another object;
• and
• a dispensing region associated with said compliant portion and being formed with at least one aperture configured to interface with said cavities in said mold plate, said at least one aperture being in fluid communication with said solder delivery head;
• wherein said compliant portion is configured and dimensioned to urge said dispensing region against said mold plate When held a predetermined distance therefrom and to substantially tolerate at least one of variations in flatness of said mold plate, variations in said predetermined distance, and variations in an angular orientation of said interface portion and said mold plate.

(Currently Amended A method for filling cavities in a mold plate, said method comprising the steps of:

• providing a mold till head for filling said cavities in said mold plate, said mold fill head in turn comprising:
• a solder delivery head;
• and
• an interface portion, said interface portion in turn comprising:
• a compliant portion secured to said solder delivery head, wherein said compliant portion is configured to have a curved shape in an absence of forces from another object;
• and
• a dispensing region associated with said compliant portion and being formed with at least one aperture configured to interface with said cavities in said mold plate, said at least one aperture being in fluid communication with said solder delivery head;
• wherein said compliant portion is configured and dimensioned to urge said dispensing region against said mold plate when held a predetermined distance therefrom and to substantially tolerate at least one of variations in flatness of said mold plate, variations in said predetermined distance, and variations in an angular orientation of said interface portion and said mold plate;
• causing said mold fill head to he substantially said predetermined distance from said mold plate with said at least one aperture in fluid communication with at least one of said cavities;
• and
• flowing solder from said solder delivery head, through said at least one aperture, into said at least one of said cavities.