Semiconductor workpiece carriers and methods for processing semiconductor workpieces
AssigneeMicron Technology, Inc.
InventorsChee Peng Neo, Hong Hak Teo, Jamilon Bin Sukami
Life of this patent
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Abstract
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
Claims13
A semiconductor workpiece carrier assembly, comprising:
- a support structure having an opening sized to receive at least a portion of a semiconductor workpiece;
- and
- a replaceable carrier including a base having a surface including a perimeter portion and a central portion generally aligned with the opening and an adhesive releasably attaching the replaceable carrier to the support structure, wherein the adhesive covers only the perimeter portion and wherein the central portion is exposed and sized to directly couple to a semiconductor component, and wherein, without a semiconductor component attached to the base, the base is not comprised of an adhesive.
A releasable carrier for supporting semiconductor components, the releasable carrier comprising:
- a generally flexible base having a first major surface and a second major surface opposite the first major surface, the first major surface having a first portion and a second portion different than the first portion, wherein the first portion is exposed and sized such that a plurality of individual semiconductor components can contact the first portion of the first major surface, and wherein, without a semiconductor component attached to the base, the base is not comprised of an adhesive;
- and
- an adhesive layer disposed on the second portion of the first major surface but not on the first portion of the first major surface.
Dependencies are inferred from the claim text.