Methods of providing semiconductor components within sockets
AssigneeMicron Technology, Inc.
InventorsDaniel P. Cram, A. Jay Stutzman
Life of this patent
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Abstract
The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.
Claims7
A method of providing a semiconductor component within a socket, comprising:
- providing the socket;
- said socket comprising a base, a retention mechanism associated with the base and configured to retain the semiconductor component, and a lid on the base;
- the lid being movable to shift the retention mechanism between a retaining position and a non-retaining position;
- providing an optical alignment tool for determining alignment of the component within the socket;
- providing a manipulator for moving the component to the socket;
- while the retention mechanism is in the non-retaining position, utilizing the optical alignment tool and the manipulator to place the component in a desired orientation within the socket;
- while the manipulator holds the component within the socket, shifting the retention mechanism to the retaining position;
- and
- after the retention mechanism is in the retaining position, releasing the component from the manipulator.
Dependencies are inferred from the claim text.