Electronic component cover and arrangement

An electronic component arrangement, comprising:

• a first electronic component adapted to be mounted on a circuit board;
• a cover having a first region substantially covering at least one side of the first electronic component, the cover having a second region comprising a cavity in a surface of the cover adapted to accommodate a second electronic component such that, when positioned in the cavity, an outer surface of the second electronic component is substantially flush with the surface of the cover;
• and
• one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;
• wherein the one or more leads are electrically isolated from the cover.

An electronic component arrangement, comprising:

• a first electronic component adapted to be mounted on a circuit board;
• a cover having a first region substantially covering at least one side of the first electronic component;
• a second electronic component positioned in a cavity in a surface of the cover such that an outer surface of the second electronic component is substantially flush with the surface of the cover;
• and
• one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;
• wherein the one or more leads are electrically isolated from the cover.