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US 8,009,436 B2Granted
Integrated circuit package system with channel
AssigneeSTATS ChipPAC, Ltd.
InventorsMyoungho Lee, Taegyu Kang
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system provides a substrate and contact pads are formed on the substrate. A channel is formed in the substrate between the contact pads. A circuit component is electrically connected to the contact pads, with the circuit component over the channel. The circuit component, the contact pads, and the channel are encapsulated in encapsulant, the encapsulant flowing into the channel.
Claims20
A method of making an integrated circuit package system, comprising:
- providing a substrate, having active component contact pads on a first side;
- forming passive component contact pads in a discrete contact pair on the first side of the substrate beyond the active component contact pads;
- providing a circuit component coupled across the passive component pads in an x-direction;
- forming a channel, having a bottom, in the first side of the substrate between the passive component contact pads of the discrete contact pair, with the channel having a y-direction perpendicular to the x-direction and the channel having a first distance formed beyond the circuit component and a second distance shorter than the first distance formed beyond the circuit component;
- electrically connecting the circuit component to the passive component contact pads of the discrete contact pair, with the circuit component over the channel;
- and
- encapsulating the circuit component, first side of the substrate, the active component contact pads, the passive component contact pads, and the channel in an encapsulant, the encapsulant filling the channel and the space between the bottom and the circuit component.
4 more elements
A method of making an integrated circuit package system, comprising:
- providing a substrate, having active component contact pads on a first side;
- forming passive component contact pads in a discrete contact pair on the first side of the substrate beyond the active component contact pads;
- providing a discrete component coupled across the passive component pads in an x-direction;
- forming a channel, having a bottom, in the first side of the substrate between the passive component contact pads of the discrete contact pair, with the channel having a y-direction perpendicular to the x-direction and the channel having a first distance formed beyond the discrete component and a second distance shorter than the first distance formed beyond the discrete component;
- electrically connecting the discrete component to the passive component contact pads of the discrete contact pair with electrically conductive adhesive, with the discrete component over the channel;
- and
- encapsulating the discrete component, the first side of the substrate, the active component contact pads, the passive component contact pads, the electrically conductive adhesive, and the channel in encapsulant, the encapsulant filling the channel including the space between the bottom, the discrete component, and the electrically conductive adhesive.
4 more elements
An integrated circuit package system, comprising:
- a substrate, having a channel and active component contact pads on a first side of the substrate, including passive component contact pads formed in a discrete contact pad beyond the active component contact pads and the channel between the passive component contact pads and the channel having a bottom;
- a circuit component electrically connected to the passive component contact pads of the discrete contact pair, with the circuit component coupled in an x-direction over the substrate having the channel having a y-direction perpendicular to the x-direction and the channel having a first distance formed beyond the circuit component and a second distance shorter than the first distance formed beyond the circuit component;
- and
- an encapsulant encapsulating the circuit component, first side of the substrate, the active component contact pads, the passive component contact pads, and the channel filled includes the space between the bottom and the circuit component.
1 more element
Dependencies are inferred from the claim text.