Liquid submersion cooling system

A liquid submersion-cooled server computer system, comprising:

• a case having an interior space and configured to hold a dielectric cooling liquid within the interior space;
• the dielectric cooling liquid within the interior space;
• a plurality of server computer units disposed within the interior space and submerged in the dielectric cooling liquid;
• each server computing unit of the plurality of server computer units comprising a circuit board disposed entirely within the interior space and a plurality of electronically and thermally active components that form the each server computing unit disposed on the circuit board, the plurality of electronically and thermally active components including a computing processor, daughter cards and memory;
• the plurality of electronically and thermally active components are submerged in the dielectric cooling liquid such that the dielectric cooling liquid absorbs heat generated by the plurality of electronically and thermally active components without the dielectric cooling liquid changing phase;
• a liquid distribution unit connected to the case and configured to distribute the dielectric cooling liquid to and from the case;
• a cooling mechanism within the interior space that directs a flow of the dielectric cooling liquid directly onto at least one of the plurality of submerged electronically and thermally active components of at least one of the plurality of server computer units;
• and
• a heat exchange unit connected to the liquid distribution unit and configured to dissipate heat absorbed by the dielectric cooling liquid.

A method of cooling a computing system of a computer, the computing system including electronically and thermally active components, the electronically and thermally active components including a computing processor, daughter cards and memory disposed on a motherboard, comprising:

• disposing the motherboard entirely within an interior space of the computer;
• submerging the electronically and thermally active components of the computing system in a dielectric cooling liquid in the interior space within the computer so that the electronically and thermally active components including the computing processor, the daughter cards and the memory are in direct contact with the dielectric cooling liquid;
• and
• directing a flow of the dielectric cooling liquid directly onto at least one of the submerged electronically and thermally active components.