Display panel, method of inspecting lead bonding of display panel, and lead bonding method of display panel

A display panel, comprising:

• a substrate, having a display region and a non-display region at one side of the display region, wherein the non-display region has a plurality of pad regions, each pad region has a plurality of first leads and at least one first displacement measuring mark, and the first displacement measuring mark is located at at least one side of all the first leads;
• and
• a plurality of films for carrying chips correspondingly sticking on the substrate, wherein each film for carrying chips has a plurality of second leads and at least one second displacement measuring mark, the second displacement measuring mark is located at at least one side of all the second leads and is corresponding to the first displacement measuring mark;
• and
• a plurality of carrying regions, defined in the pad regions respectively by the first displacement measuring mark aiming to the second displacement measuring mark, wherein an alignment offset amount between the first displacement measuring mark and the second displacement measuring mark is zero, and the first leads in the carrying regions are bonded with the second leads.