Balun circuit manufactured by integrate passive device process

A semiconductor circuit, including:

• a base substrate;
• an integrate passive device (IPD), including a Balun circuit, the Balun circuit comprising:
• a substrate;
• a first coplanar spiral structure having a first end, a second end, a first connecting line, a second connecting line, a plurality of first left coils, a plurality of first right coils, and at least one first intersecting structure, wherein at least two first left coils are electrically connected to the corresponding two first right coils through one first intersecting structure, the first end is electrically connected to the outermost first left coil through the first connecting line, and the second end is electrically connected to the outermost first right coil through the second connecting line;
• and
• a second coplanar spiral structure having a third end, a fourth end, a third connecting line, a fourth connecting line, a plurality of second left coils, a plurality of second right coils, and at least one second intersecting structure, wherein at least two second left coils are electrically connected to the corresponding two second right coil through one second intersecting structure, the third end is electrically connected to the innermost second left coil through the third connecting line, the fourth end is electrically connected to the innermost second right coil through the fourth connecting line, wherein the first left coils and the second left coils are interlaced, and so are the first right coils and the second right coils interlaced;
• and
• a chip, electrically connected to the IPD, the chip overlapped with the IPD relative to the base substrate.

A Balun circuit manufactured by integrate passive device (IPD) process, comprising:

• a substrate;
• a first coplanar spiral structure having a first end, a second end, a plurality of first left coils, a plurality of first right coils and a first bridge, wherein one end of the innermost first left coil is electrically connected to the innermost first right coil through a first bridge, the first end is electrically connected to the outermost first left coil, and the second end is electrically connected to the outermost first right coil;
• a second coplanar spiral structure having a third end, a fourth end, a plurality of second left coil, a plurality of second right coil and a second bridge, wherein one end of the innermost second left coil is electrically connected to the innermost second right coil through the second bridge, the third end is electrically connected to the outermost second left coil, and the fourth end is electrically connected to the outermost second right coil, wherein the first left coils and the second left coils are interlaced, and the first right coils and the second right coils are interlaced;
• and
• a plurality of capacitors, wherein the first end, the third end and the fourth end are electrically connected to the capacitors respectively.