Burn-in system for electronic devices
AssigneeFreescale Semiconductor, Inc.
InventorsWei Ping Wong, Chee Keong Chiew, Kok Hua Lee
Life of this patent
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Abstract
A burn-in system (10) includes an enclosure (12) defining a burn-in chamber (14). The enclosure (12) is configured to be mounted on a burn-in board (34) over a burn-in socket (36). A heating element (16) is configured to generate heat within the burn-in chamber (14) and a temperature sensor (18) is configured to sense a temperature within the burn-in chamber (14). An opening (24) is formed in the enclosure (12) for receiving a fluid (26). A controller (20) is configured to control the heating element (16) and fluid flow into the enclosure (12) in response to the temperature sensed by the temperature sensor (18).
Claims14
A burn-in system for performing burn-in testing of a single semiconductor device among a plurality of semiconductor devices each mounted in a corresponding one of a burn-in socket of a plurality of burn-in sockets on a burn-in board, the system comprising:
- an enclosure defining a burn-in chamber, wherein the enclosure is configured to be mounted on the burn-in board over one of the burn-in sockets;
- a heating element within the burn-in chamber configured to generate heat within the burn-in chamber;
- a temperature sensor within the burn-in chamber configured to sense a temperature within the burn-in chamber;
- an opening in the enclosure for receiving a fluid;
- a controller configured to control the heating element and fluid flow into the enclosure in response to the temperature sensed by the temperature sensor;
- and
- wherein the enclosure comprises a housing pivotally coupled to a base, wherein the base is configured to be mounted on the burn-in board and to fit around a periphery of the one of the burn-in sockets.
A burn-in apparatus, comprising:
- an enclosure defining a burn-in chamber, the enclosure comprising a housing pivotally coupled to a base, wherein the base is configured to be mounted on a burn-in board and to fit around a periphery of a burn-in socket, the burn-in socket for receiving a single semiconductor device to undergo burn-in testing and wherein the burn-in board includes a plurality of the burn-in sockets for simultaneously testing a plurality of the semiconductor devices;
- a heating element within the burn-in chamber configured to generate heat within the burn-in chamber;
- a temperature sensor within the burn-in chamber configured to sense a temperature within the burn-in chamber;
- an opening in the enclosure for receiving a fluid;
- and
- a controller configured to control the heating element and fluid flow into the enclosure in response to the temperature sensed by the temperature sensor, and
- wherein the burn-in board includes one or more probe points that are not covered by the enclosure and may be accessed during the burn-in testing.
Dependencies are inferred from the claim text.