Micromachined piezoelectric ultrasound transducer arrays
AssigneeTRS Technologies, Inc.
InventorsXiaoning Jiang, Wesley S. Hackenberger, Kevin A. Snook
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Abstract
A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
Claims8
A micromachined piezoelectric ultrasound transducer array, comprising:
- a plurality of piezoelectric composite elements;
- at least one through-wafer-via electrically interconnecting at least two of the plurality of piezoelectric composite elements.
Dependencies are inferred from the claim text.