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US 8,008,787 B2Granted
Integrated circuit package system with delamination prevention structure
AssigneeSTATS ChipPAC, Ltd.
InventorsDongSam Park, A Leam Choi, Keon Teak Kang
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.
Claims18
A method of manufacturing an integrated circuit package system comprising:
- mounting an integrated circuit die to a carrier by an adhesive;
- attaching a delamination prevention structure having an uniform thickness, directly on a center of the integrated circuit die including positioning the delamination prevention structure within the boundary of the integrated circuit die;
- and
- encapsulating the delamination prevention structure and the integrated circuit die, with only an encapsulation between a top side of the encapsulation and the delamination prevention structure.
1 more element
A method of manufacturing an integrated circuit package system comprising:
- mounting an integrated circuit die to a carrier by an adhesive;
- connecting an internal interconnect between the integrated circuit die and the carrier;
- attaching a delamination prevention structure having an uniform thickness, directly on a center of the integrated circuit die including positioning the delamination prevention structure within the boundary of the integrated circuit die;
- and
- forming an encapsulation having a recess over directly on the delamination prevention structure, the integrated circuit die, and the internal interconnect with the recess over the delamination prevention structure, with only the encapsulation between a top side of the encapsulation and the delamination prevention structure.
2 more elements
An integrated circuit package system comprising:
- a carrier;
- an integrated circuit die mounted to the carrier by an adhesive;
- a delamination prevention structure having an uniform thickness, directly on a center of the integrated circuit die includes the delamination prevention structure is within the boundary of the integrated circuit die;
- and
- an encapsulation directly on the delamination prevention structure and the integrated circuit die, with only the encapsulation between a top side of the encapsulation and the delamination prevention structure.
2 more elements
Dependencies are inferred from the claim text.