Package including a lead frame, a chip and a sealant

A package, comprising:

• a lead frame, which has a notch and a first edge and a second edge opposite to the first edge, wherein a first side of the notch is substantially parallel to the first edge, and a second side of the notch is substantially parallel to the second edge, and the lead frame comprises:
• a plurality of first notch-side leads extending to the first side;
• a plurality of first notch-side pads correspondingly disposed on the first notch-side leads;
• a plurality of second notch-side leads extending to the second side;
• and
• a plurality of second notch-side pads correspondingly disposed on the second notch-side leads;
• a chip, which is disposed on an upper surface of the lead frame and has a plurality of pads;
• a plurality of conductive bumps for electrically connecting the pads to the first notch-side pads and the second notch-side pads;
• and
• a sealant for sealing up the chip, the conductive bumps and the lead frame and exposing a lower surface of the lead frame,
• wherein the notch exposes a portion of the sealant.