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US 8,008,783 B2Granted
Dicing tape and die attach adhesive with patterned backing
Assignee3M Innovative Properties Company
InventorsDavid J. Plaut, Eric G. Larson, Joel A. Getschel, Olester Benson, Jr.
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Abstract
Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
Claims12
An adhesive transfer dicing tape suitable for consecutive use as a dicing tape and a die attach adhesive comprising:
- an adhesive composition;
- and
- a backing having a surface in contact with the adhesive composition,
- wherein the surface of the backing in contact with the adhesive composition has a pattern that has altered surface energy,
- wherein the adhesive is in contact with at least a portion of the pattern, and
- wherein the pattern comprises a closed loop.
3 more elements
Dependencies are inferred from the claim text.