Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

An electrical device comprising:

• the semiconductor chip package including:
• a semiconductor chip including a first surface having a plurality of bonding pads, a second surface facing the first surface, and sidewalls;
• a molding extension part surrounding the second surface and the sidewalls of the semiconductor chip;
• a plurality of redistribution patterns extending from the bonding pads over the molding extension part, and electrically connected to the bonding pads;
• a plurality of bump solder balls on the redistribution patterns;
• and
• a molding layer configured to cover the first surface of the semiconductor chip and the molding extension part, while exposing portions of each of the bump solder balls,
• wherein the molding layer has concave meniscus surfaces between the bump solder balls adjacent to each other, and
• wherein the molding layer has a thermal expansion coefficient below 50ppm/° C., in a temperature range below a glass transition temperature;
• and
• a wiring substrate in which the semiconductor chip package is mounted on one surface thereof.

A method of fabricating a semiconductor chip package comprising:

• preparing a semiconductor chip having a first surface including a plurality of bonding pads, a second surface facing the first surface, and sidewalls;
• forming a molding extension part surrounding the second surface and the sidewalls of the semiconductor chip;
• forming a plurality of redistribution patterns extending from the bonding pads over the molding extension part, and electrically connected to the bonding pads;
• forming a plurality of bump solder balls on the redistribution patterns;
• and
• forming a molding layer configured to cover the first surface of the semiconductor chip and the molding extension part while exposing portions of each of the bump solder balls such that the molding layer has concave meniscus surfaces between the bump solder balls adjacent to each other,
• wherein the molding layer has a thermal expansion coefficient below 50ppm/° C., in a temperature range below a glass transition temperature.