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US 8,008,770 B2Granted
Integrated circuit package system with bump pad
AssigneeSTATS ChipPAC, Ltd.
InventorsYaojian Lin, Romeo Emmanuel P. Alvarez, Haijing Cao, Wan Lay Looi
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Abstract
An integrated circuit package system includes an integrated circuit, and forming a patterned redistribution pad over the integrated circuit.
Claims20
An integrated circuit package system comprising:
- providing an integrated circuit;
- forming a patterned redistribution pad over the integrated circuit, the patterned redistribution pad including patterned redistribution pad openings along a perimeter of and through the patterned redistribution pad wherein the pattern redistribution pad is conductive:
- and
- filling the patterned redistribution pad openings with a solid material wherein the solid material is conductive.
1 more element
An integrated circuit package system comprising:
- providing an integrated circuit wafer;
- forming a redistribution layer over the integrated circuit wafer having a redistribution trace and a patterned redistribution pad, the patterned redistribution pad including patterned redistribution pad openings along a perimeter of and through the patterned redistribution pad wherein the pattern redistribution pad is conductive:
- filling the patterned redistribution pad openings with a solid material wherein the solid material is conductive;
- and
- applying an under bump layer over the patterned redistribution pad.
2 more elements
An integrated circuit package system comprising:
- an integrated circuit;
- and
- a patterned redistribution pad over the integrated circuit, the patterned redistribution pad including patterned redistribution pad openings along a perimeter of and through the patterned redistribution pad wherein the pattern redistribution pad is conductive and the patterned redistribution pad openings filled with a solid material wherein the solid material is conductive.
Dependencies are inferred from the claim text.