Semiconductor device having heat radiating configuration
AssigneeDenso Corporation
InventorTakeshi Miyajima
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Abstract
A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes: a casing, a board and a semiconductor chip. The chip includes: an element part; a heat sink bonded to the element part; an insulting layer located on the heat sink so that the heat sink is located between the element part and the insulating layer; and a side wall insulating layer covering all of end faces of the heat sink. The semiconductor chip is located between the casing and the board, so that the insulating layer is directed to the casing to enable heat radiation from the heat sink toward the casing via the insulating layer.
Claims4
A semiconductor device comprising:
- a casing made of metal;
- a board having a wiring pattern;
- and
- a semiconductor chip including:
- a semiconductor substrate;
- an element part located in the semiconductor substrate, having an element, and having first and second surface opposite to each other;
- an electrode part located on the first surface of the element part to provide an electrical connection to the element of the element part;
- a heat sink bonded to the second surface of the element part;
- an insulating layer located on the heat sink so that the heat sink is located between the element part and the insulating layer;
- and
- a side wall insulating layer covering all of end faces of the heat sink, wherein:
- the semiconductor chip is located between the casing and the board, so that the electrode part of the semiconductor chip is electrically connected with the wiring pattern of the board, and so that heat from the heat sink is radiated toward the casing via the insulating layer.
Dependencies are inferred from the claim text.