Stacked semiconductor module
AssigneePanasonic Corporation
InventorsTakeshi Kawabata, Toshiyuki Fukuda
Life of this patent
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Abstract
A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal.
Claims9
A stacked semiconductor module,
- wherein the module is made by stacking a second semiconductor device above a first semiconductor device, the second semiconductor device having a second semiconductor chip mounted to a top surface of a second semiconductor substrate, the first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate,
- a top surface of the first semiconductor substrate is provided with a first connection terminal,
- a bottom surface of the second semiconductor substrate is provided with a second connection terminal,
- a first conductive connecting member connects the first connection terminal to the second connection terminal,
- a resin is formed on a side face of the second semiconductor chip, and
- said stacked semiconductor module is arranged such that a first outer periphery of a first region in which the resin is formed surrounds, in plan view, a second outer periphery of a second region in which the second semiconductor chip is held, thereby forming a middle region between said first and second outer periphery,
- wherein at least a portion of said first conductive connecting member is formed, in plan view, in said middle region.
Dependencies are inferred from the claim text.