Semiconductor package having adhesive layer and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorIn-ku Kang
Life of this patent
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Abstract
A semiconductor package includes a first substrate comprising a plurality of pads arranged in a first side of the first substrate, a plurality of first semiconductor chips stacked on the first side of the first substrate and each first semiconductor chip comprising a plurality of chip pads arranged in a first side of respective first semiconductor chips, and a sealant arranged on the first substrate, the sealant sealing the first semiconductor chips, wherein at least one of the first semiconductor chips comprises a plurality of redistribution pads arranged in the first side of the at least one semiconductor chip, and a plurality of adhesive layers having portions exposed by the sealant, each adhesive layer is disposed on respective redistribution pads.
Claims17
A semiconductor package comprising:
- a first substrate comprising a plurality of pads arranged in a first side of the first substrate;
- a plurality of first semiconductor chips stacked and vertically aligned on the first side of the first substrate, each first semiconductor chip being directly electrically connected to the first substrate, and each first semiconductor chip comprising a plurality of chip pads arranged in a first side of respective first semiconductor chips;
- and
- a sealant arranged on the first substrate, the sealant partially sealing the first semiconductor chips,
- wherein at least one of the first semiconductor chips comprises:
- a plurality of redistribution pads arranged in the first side of the at least one semiconductor chip;
- and
- a plurality of adhesive layers having portions exposed by the sealant, each adhesive layer is disposed on respective redistribution pads.
Dependencies are inferred from the claim text.