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US 8,008,764 B2Granted
Bridges for interconnecting interposers in multi-chip integrated circuits
AssigneeInternational Business Machines Corporation
InventorsDouglas James Joseph, John Ulrich Knickerbocker
Life of this patent
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Abstract
A structure and a method for forming the same. The structure includes a substrate, a first interposer on the substrate, a second interposer on the substrate, and a first bridge. The first and second interposers are electrically connected to the substrate. The first bridge is electrically connected to the first and second interposers.
Claims18
A structure, comprising:
- a substrate;
- a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
- a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate;
- and
- a first bridge electrically connected to the first and second interposers, wherein the first interposer comprises at least a first transistor, and wherein the second interposer comprises at least a second transistor.
2 more elements
A structure, comprising:
- a substrate;
- a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
- a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate;
- and
- a first bridge electrically connected to the first and second interposers, wherein the first bridge is in direct physical contact with the substrate.
2 more elements
A structure, comprising:
- a substrate;
- a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
- a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate;
- and
- a first bridge electrically connected to the first and second interposers, wherein the first bridge is in direct physical contact with the substrate,
- wherein a top surface of the first bridge is external to the substrate and above a top surface of the substrate,
- wherein a bottom surface of the first bridge is within the substrate and below the top surface of the substrate.
4 more elements
A structure, comprising:
- a substrate;
- a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
- a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate;
- and
- a first bridge electrically connected to the first and second interposers, wherein a bottom surface of the first bridge is within the substrate and below a top surface of the substrate.
2 more elements
Dependencies are inferred from the claim text.