Stacked electronic component and manufacturing method thereof

A stacked semiconductor element, comprising:

• a substrate having electrode portions;
• a first electronic component, mounted on the substrate, having first electrode pads connected to the electrode portions via first bonding wires;
• a second electronic component, stacked on the first electronic component, having
• protruding portions including four sides respectively protruding outside from an outer periphery of the first electronic component, and
• second electrode pads disposed at upper surfaces of the protruding portions respectively and connected to the electrode portions via second bonding wires;
• a plurality of insulating columnar bodies supporting and adhered to lower surface surfaces of the protruding portions of the second electronic component respectively, each of the insulating columnar bodies having a planate portion in contact with one of the lower surfaces of the protruding portions, and
• a dam frame is provided at an outer periphery of one of the insulating columnar bodies,
• wherein:
• the insulating columnar bodies are spaced away from the first electronic component,
• each of the protruding portions is supported with a plurality of the insulating columnar bodies, and
• at least one of the insulating columnar bodies is located directly below one of the second electrode pads.