Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

An electronic device package assembly, comprising:

• an interposer having at least one conductive pathway including an attachment pad on a surface thereof;
• an optically interactive device mounted on the interposer and having a surface with an image sensitive area having a microlens formed thereon and at least one bond pad outside the image sensitive area;
• a transparent cover bonded over the image sensitive area to the surface of the optically interactive device between a peripheral edge of the image sensitive area and the at least one bond pad, the transparent cover bonded to the surface of the optically interactive device using an adhesive comprising a silicone, an acrylic, a double-sided adhesive-coated tape segment, such as a polymide, and a double-sided adhesive-coated film such as a polymide;
• an electrical connection between the at least one bond pad and the attachment pad of the at least one conductive pathway of the interposer;
• and
• a layer of encapsulant material over the surface of the interposer partially covering the optically interactive device and leaving the transparent cover substantially exposed.