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US 8,008,759 B2Granted
Pre-molded clip structure
AssigneeFairchild Semiconductor Corporation
InventorsErwin Victor Cruz, Maria Cristina B. Estacio
Life of this patent
Estimating the term…
Abstract
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
Claims17
A premolded clip structure comprising:
- a clip comprising a die attach surface;
- and
- a molding material coupled to the clip and comprising a molding material surface, wherein the die attach surface is exposed by the molding material surface.
A semiconductor die package comprising:
- a premolded clip structure comprising a clip comprising a die attach surface and a molding material coupled to the clip, wherein the molding material comprises a molding material surface, and wherein the die attach surface is exposed by the molding material surface;
- and
- a semiconductor die comprising a first die surface and a second die surface, and a first electrical terminal and a second electrical terminal at the first die surface, wherein the first die surface is electrically coupled to the first electrical terminal.
Dependencies are inferred from the claim text.