Mold for forming molding member and method of manufacturing LED package using the same
AssigneeSamsung LED Co., Ltd.
InventorJoung Il Kweon
Life of this patent
Estimating the term…
Abstract
Provided is a method of manufacturing a light emitting diode (LED) package, the method including the steps of: preparing a package substrate having an LED chip mounted thereon; preparing a mold which has a convex portion, a plane portion extending outward from the convex portion, and a projecting portion formed on the lower surface of the plane portion, the projecting portion having a sharp end; engaging the mold with the package substrate such that the projecting portion is contacted with the surface of the package substrate; and filling transparent resin into the convex portion.
Claims25
A method of manufacturing a light emitting diode (LED) package, comprising:
- preparing a package substrate having an LED chip mounted thereon;
- preparing a mold which has a convex portion, a plane portion extending outward from the convex portion, and a projecting portion formed on the lower surface of the plane portion, the projecting portion having a sharp end;
- engaging the mold with the package substrate such that the sharp end of the projecting portion is in contact with an upper surface of the package substrate;
- and
- filling transparent resin into the convex portion,
- the package substrate and the mold being engaged in such a manner that the package substrate and the sharp end of the projecting portion of the mold come into line contact with each other.
A method of manufacturing an LED package, comprising:
- preparing a package substrate having an LED chip mounted thereon;
- forming a projecting portion which projects from an upper surface of the package substrate and has an outer surface inclined toward the inside;
- preparing a mold which has a convex portion and a plane portion extending outward from the convex portion;
- engaging the mold with the package substrate such that the mold is contacted with the outer surface of the projecting portion;
- and
- filling transparent resin into the convex portion,
- the package substrate and the mold being engaged in such a manner that the projecting portion of the package substrate and the mold come into line contact with each other.
A mold for forming a molding member on a package substrate having an LED chip mounted thereon, the mold comprising:
- a convex portion;
- a plane portion that extends from the convex portion to form a plane surface;
- and
- a projecting portion that projects from the lower surface of the plane portion and has a sharp end,
- the sharp end of the projecting portion coming into line contact with an upper surface the package substrate.
A method of manufacturing an LED package, comprising:
- preparing a package substrate having an LED chip mounted thereon;
- preparing a mold which has a convex portion and a plane portion;
- engaging the mold with the package substrate;
- and
- filling transparent resin into the convex portion such that a hemispheric molding member is formed on the LED chip,
- any one of the mold and the package substrate having a projecting portion with a sharp end, and
- the package substrate and the mold being engaged in such a manner that the package substrate and the mold come into line contact with each other due to the sharp end of the projection portion.
Dependencies are inferred from the claim text.