Semiconductor package having an antenna with reduced area and method for fabricating the same
AssigneeHynix Semiconductor Inc.
InventorTae Min Kang
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.
Claims18
A semiconductor package, comprising:
- an electromagnetic shielding member for shielding electromagnetic waves;
- an antenna disposed over an upper face of the electromagnetic shielding member, the antenna comprising:
- an antenna part having a plurality of conductive polarized particles electrically connected with each other;
- and
- an insulation part surrounding the antenna part to insulate the antenna part;
- RFID chip ball lands disposed on the electromagnetic shielding member and electrically coupled to the antenna part;
- a Radio Frequency identification (RFID) chip electrically coupled to the RFID chip ball lands;
- a semiconductor chip having the electromagnetic shielding member disposed thereon such that a lower face of the electromagnetic shielding member opposite to the upper face of the electromagnetic shielding member faces the semiconductor chip;
- a substrate electrically connected to the semiconductor chip;
- and
- a molding member for molding the RFID chip and the semiconductor chip.
A semiconductor package, comprising:
- an electromagnetic shielding member for shielding electromagnetic waves;
- an antenna disposed over an upper face of the electromagnetic shielding member, the antenna comprising:
- an antenna part having a plurality of conductive polarized particles electrically connected with each other;
- and
- an insulation part surrounding the antenna part to insulate the antenna part;
- RFID chip ball lands disposed on the electromagnetic shielding member and electrically coupled to the antenna part;
- a Radio Frequency Identification (RFID) chip electrically coupled to the RFID chip ball lands;
- a substrate on which the electromagnetic shielding member is disposed such that a lower face of the electromagnetic shielding member opposite the upper face of the electromagnetic shielding member faces the substrate;
- a semiconductor chip disposed on the substrate and electrically connected to the substrate;
- and
- a molding member for molding the RFID chip and the semiconductor chip.
A semiconductor package, comprising:
- an electromagnetic shielding member for shielding electromagnetic waves;
- an antenna disposed over an upper face of the electromagnetic shielding member, the antenna comprising:
- an antenna part having a plurality of conductive polarized particles electrically connected with each other;
- and
- an insulation part surrounding the antenna part to insulate the antenna part;
- RFID chip ball lands disposed on the electromagnetic shielding member and electrically coupled to the antenna part;
- a Radio Frequency Identification (RFID) chip electrically coupled to the RFID chip ball lands;
- a wafer level semiconductor chip comprising:
- a first face, wherein a lower face of the electromagnetic shielding member opposite the upper face of the electromagnetic shielding member is disposed on the first face of the wafer level semiconductor chip;
- a second face opposite the first face;
- bonding pads disposed on the second face;
- redistributions electrically connected to the respective bonding pads;
- and
- an insulation film disposed over the second face and having openings defined therein for exposing a portion of the respective redistributions.
Dependencies are inferred from the claim text.