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US 8,008,753 B1Granted
System and method to reduce shorting of radio frequency (RF) shielding
AssigneeAmkor Technology, Inc.
InventorDavid Bolognia
Life of this patent
Estimating the term…
Abstract
An integrated circuit module has a substrate having a plurality of metal traces. At least one semiconductor package is electrically coupled to at least one metal trace on a first surface of the substrate. At least one electronic component is electrically coupled to at least one metal trace on the first surface of the substrate. A non-conductive coating covers exposed active surfaces on the first surface of the substrate. A conductive coating is applied to the non-conductive coating, and electrically contacting ground pads exposed on the substrate.
Claims15
An integrated circuit module comprising:
- a substrate having a plurality of metal traces;
- at least one electronic component electrically coupled to at least one metal trace on a first surface of the substrate;
- a non-conductive coating covering a top surface of the module, the non-conductive coating covering exposed surfaces on the first surface of the substrate and exposed surfaces on the at least one electronic component, wherein the non-conductive coating has an approximately uniform thickness, a top surface of the non-conductive coating being non-planar, the non-conductive coating covering exposed active surfaces to prevent shorting and improve Radio-Frequency (RF) shielding;
- a plurality of openings formed through the non-conductive coating to expose ground pads formed on the first surface of the substrate;
- a conductive coating applied to the non-conductive coating, and electrically contacting the ground pads exposed through the openings formed through the non-conductive coating;
- and
- ground pads formed by exposed metal layers formed on offset surfaces within the substrate, the conductive coating applied to the non-conductive coating and the exposed metal layers.
4 more elements
An integrated circuit module comprising:
- a substrate having a plurality of metal traces;
- at least one semiconductor package electrically coupled to at least one metal trace on a first surface of the substrate;
- at least one electronic component electrically coupled to at least one metal trace on the first surface of the substrate;
- means for covering exposed active surfaces on the first surface of the substrate, on the at least one semiconductor package, and on the at least one electronic component, means for covering preventing shorting and improving Radio Frequency (RF) shielding, wherein the means for covering has an approximately uniform thickness, a top surface of the means for covering being non-planar;
- openings formed through the means for covering to expose ground pads formed on the first surface of the substrate;
- means applied to the means for covering and electrically coupled to the ground pads exposed through the means for covering for providing Radio Frequency (RF) shielding;
- and
- ground pads formed on exposed metal layers formed on offset surfaces within the substrate, the means for providing Radio Frequency (RF) shielding applied to the means for covering exposed active surfaces on the first surface of the substrate and the exposed metal layers.
5 more elements
A method of manufacturing an integrated circuit module comprising:
- providing a substrate having a plurality of metal traces;
- coupling at least one electronic component electrically to at least one metal trace on a first surface of the substrate;
- applying a non-conductive coating having an approximately uniform thickness and non-planar top surface to cover exposed active surfaces on a first surface of the module to prevent shorting and to improve Radio Frequency (RE) shielding;
- forming openings through the non-conductive coating exposing ground pads formed on the first surface of the substrate;
- and
- applying a conductive coating to the non-conductive coating, the conductive coating electrically contacting ground pads exposed on the first surface of the substrate to provide RF shielding;
- wherein exposing ground pads further comprises performing a saw cut to the substrate to expose the ground pads.
4 more elements
Dependencies are inferred from the claim text.