High power and high temperature semiconductor power devices protected by non-uniform ballasted sources
AssigneeAlpha and Omega Semiconductor Incorporated
InventorsFrançois Hébert, Anup Bhalla
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Abstract
This invention discloses a semiconductor power device disposed on a semiconductor substrate supporting an epitaxial layer as a drift region composed of an epitaxial layer. The semiconductor power device further includes a super-junction structure includes a plurality of doped sidewall columns disposed in a multiple of epitaxial layers. The epitaxial layer have a plurality of trenches opened and filled with the multiple epitaxial layer therein with the doped columns disposed along sidewalls of the trenches disposed in the multiple of epitaxial layers.
Claims21
A semiconductor power device disposed on a semiconductor substrate comprising:
- a plurality of transistor cells distributed over different areas having varying amount of ballasting resistances depending on a local thermal dissipation in each of the different areas and wherein the transistor cells having a lower ballasting resistance are disposed near an peripheral area and the transistor cells having a higher ballasting resistance are disposed near a bond pad area.
A semiconductor power device disposed on a semiconductor substrate comprising:
- a plurality of transistor cells distributed over different areas having varying amount of ballasting resistances depending on a local thermal dissipation in each of the different areas and wherein the transistor cells having a highest ballasting resistance are disposed in an area around a wire-bonding pad, the transistor cells having a lower resistance are disposed underneath said wire-bonding pad connected to bonding wires and the transistor cells having a lowest ballasting resistance are disposed in an areas away from said bonding pad.
A semiconductor power device disposed on a semiconductor substrate comprising:
- a plurality of transistor cells distributed over different areas having varying amount of ballasting resistances depending on a local thermal dissipation in each of the different areas and wherein the semiconductor power device is divided into several areas and the transistor cells in each of said areas having a different area-specific ballasting resistance with a highest area-specific ballasting resistance around a bonding pad and a lowest ballasting resistance in an peripheral area away from said bonding pad.
A semiconductor power device disposed on a semiconductor substrate comprising:
- a plurality of transistor cells distributed over different areas having varying amount of ballasting resistances depending on a local thermal dissipation in each of the different areas and wherein the bonding pad are connected with bonding wires conducting heat therefrom and said transistor cells underneath said bonding pad having a medium area-specific ballasting resistance between said highest area-specific ballasting resistance and said lowest area-specific ballasting resistance.
A semiconductor power device disposed on a semiconductor substrate comprising:
- a plurality of transistor cells distributed over different areas having varying amount of ballasting resistances depending on a local thermal dissipation in each of the different areas and wherein the semiconductor power device having designated source wire areas and areas adjacent to said designated source wire areas and said areas adjacent to said designate source wire areas having a highest area-specific ballasting resistance and said designated source wire areas having a medium area-specific ballasting resistance and areas outside of said designated source wire areas and said areas adjacent to said designated source wire areas having a lowest area-area specific ballasting resistance.
A semiconductor power device disposed on a semiconductor substrate comprising:
- a plurality of transistor cells over different areas on said semiconductor substrate having varying amount of ballasting resistances wherein the transistor cells having a lower ballasting resistance are disposed near an peripheral area and the transistor cells having a higher ballasting resistance are disposed near a bond pad area.
Dependencies are inferred from the claim text.