Vapor deposition of silicon dioxide nanolaminates
AssigneePresident and Fellows of Harvard College
InventorsRoy G. Gordon, Jill Becker, Dennis Hausmann
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AssigneePresident and Fellows of Harvard College
InventorsRoy G. Gordon, Jill Becker, Dennis Hausmann
Estimating the term…
This invention relates to materials and processes for thin film deposition on solid substrates. Silica/alumina nanolaminates were deposited on heated substrates by the reaction of an aluminum-containing compound with a silanol. The nanolaminates have very uniform thickness and excellent step coverage in holes with aspect ratios over 40:1. The films are transparent and good electrical insulators. This invention also relates to materials and processes for producing improved porous dielectric materials used in the insulation of electrical conductors in microelectronic devices, particularly through materials and processes for producing semi-porous dielectric materials wherein surface porosity is significantly reduced or removed while internal porosity is preserved to maintain a desired low-k value for the overall dielectric material. The invention can also be used to selectively fill narrow trenches with low-k dielectric material while at the same time avoiding deposition of any dielectric on the surface area outside of the trenches.
A coated article, comprising:
An integrated circuit, comprising:
A coated article, comprising:
A coated article comprising a silica nanolaminate layer comprising at least one catalytically-grown silica layer having a thickness greater than about 2 nm and at least one layer comprising a Lewis acidic metal or metalloid that serves as a catalyst for the growth of said silica layer, wherein each of said layer comprising a Lewis acid metal or metalloid comprises at most an atomic monolayer of said Lewis acidic metal or metalloid,
Dependencies are inferred from the claim text.