Low resistance tunneling magnetoresistive sensor with composite inner pinned layer
AssigneeHeadway Technologies, Inc.
InventorsTong Zhao, Hui-Chuan Wang, Kunliang Zhang, Yu-Hsia Chen, Min Li
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AssigneeHeadway Technologies, Inc.
InventorsTong Zhao, Hui-Chuan Wang, Kunliang Zhang, Yu-Hsia Chen, Min Li
Estimating the term…
A high performance TMR sensor is fabricated by employing a composite inner pinned (AP1) layer in an AP2/Ru/AP1 pinned layer configuration. In one embodiment, there is a 10 to 80 Angstrom thick lower CoFeB or CoFeB alloy layer on the Ru coupling layer, a and 5 to 50 Angstrom thick Fe or Fe alloy layer on the CoFeB or CoFeB alloy, and a 5 to 30 Angstrom thick Co or Co rich alloy layer formed on the Fe or Fe alloy. A MR ratio of about 48% with a RA of <2 ohm-um2 is achieved when a CoFe AP2 layer, MgO (NOX) tunnel barrier, and CoFe/NiFe free layer are used in the TMR stack. Improved RA uniformity and less head noise are observed. Optionally, a CoFe layer may be inserted between the coupling layer and CoFeB or CoFeB alloy layer to improve pinning strength and enhance crystallization.
A pinned layer in a magnetoresistive element of a magnetic device, comprising:
A TMR sensor in a magnetic device, comprising:
Dependencies are inferred from the claim text.