Plasma processing apparatus and electrode used therein
AssigneeTokyo Electron Limited
InventorsAkira Koshiishi, Takashi Suzuki
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsAkira Koshiishi, Takashi Suzuki
Estimating the term…
A plasma processing apparatus performs a specific plasma processing on a target substrate by disposing a first and a second electrode to face each other in a processing chamber, and supplying high-frequency electric power to at least one of the first and the second electrodes to thereby generate a plasma while introducing a processing gas onto the target substrate supported by the second electrode. The electrode for use as the first electrode includes: an electrode plate facing the second electrode; a support for supporting the electrode plate, wherein the support is in contact with a surface of the electrode plate and the surface is opposite to the second electrode; and a dielectric portion, provided on a contact surface of the support with the electrode plate, and having a shape in which a center portion thereof has a height different from that of an edge portion thereof.
An electrode for use as an upper electrode in a plasma processing apparatus for performing a specific plasma processing on a target substrate placed in a processing chamber having the upper electrode and a lower electrode the electrode for use as the upper electrode comprising:
An electrode for use as an upper electrode in a plasma processing apparatus for performing a specific plasma processing on a target substrate placed in a processing chamber having the upper electrode and a lower electrode, the electrode for use as the upper electrode comprising:
A plasma processing apparatus comprising:
A plasma processing apparatus comprising:
A plasma processing apparatus comprising:
Dependencies are inferred from the claim text.